64-bit Intel Xeon Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines

64-bit Intel® Xeon™ Processor with 2MB L2 Cache Thermal/Mechanical Design Guideline 3
Contents
1 Introduction.........................................................................................................................7
1.1 Objective ..............................................................................................................................7
1.2 Scope...................................................................................................................................7
1.3 References...........................................................................................................................7
1.4 Definition of Terms...............................................................................................................8
2 Thermal/Mechanical Reference Design ...........................................................................11
2.1 Mechanical Requirements .................................................................................................11
2.1.1 Processor Mechanical Parameters......................................................................11
2.1.2 64-bit Intel® Xeon™ Processor with 2MB L2 Cache Package............................12
2.1.3 64-bit Intel® Xeon™ Processor with 2MB L2 Cache Considerations..................13
2.2 Thermal Requirements ......................................................................................................14
2.2.1 Thermal Profile ....................................................................................................14
2.2.2 TCONTROL Definition.........................................................................................16
2.2.3 Dual Thermal Profile Concept for the 64-bit Intel® Xeon™ Processor with
2MB L2 Cache.....................................................................................................17
2.2.4 Performance Targets...........................................................................................18
2.2.5 Altitude.................................................................................................................19
2.3 Characterizing Cooling Solution Performance Requirements............................................19
2.3.1 Fan Speed Control ..............................................................................................19
2.3.2 Processor Thermal Characterization Parameter Relationships...........................20
2.3.3 Chassis Thermal Design Considerations ............................................................23
2.4 Thermal/Mechanical Reference Design Considerations....................................................23
2.4.1 Heatsink Solutions...............................................................................................23
2.4.2 Thermal Interface Material...................................................................................24
2.4.3 Summary .............................................................................................................25
2.4.4 Assembly Overview of the Intel Reference Thermal Mechanical Design............25
2.4.5 Thermal Solution Performance Characteristics ...................................................27
2.4.6 Thermal Profile Adherence..................................................................................29
2.4.7 Components Overview ........................................................................................31
2.4.8 Boxed Active Thermal Solution for the 64-bit Intel® Xeon™ Processor with
2MB L2 Cache.....................................................................................................34
A Mechanical Drawings.......................................................................................................39
B Safety Requirements........................................................................................................61
C Quality and Reliability Requirements ...............................................................................63
C.1 Intel Verification Criteria for the Reference Designs ..........................................................63
C.1.1 Reference Heatsink Thermal Verification............................................................63
C.1.2 Environmental Reliability Testing ........................................................................63
C.1.3 Material and Recycling Requirements.................................................................65
D Enabled Suppliers Information .........................................................................................67
D.1 Supplier Information...........................................................................................................67
D.1.1 Intel Enabled Suppliers........................................................................................67
D.1.2 Additional Suppliers.............................................................................................68
E Processor Thermal Management Logic and Thermal Monitor Features..........................69