64-bit Intel Xeon Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines

64-bit Intel® Xeon™ Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines 65
Quality and Reliability Requirements
C.1.2.4 Recommended Test Sequence
Each test sequence should start with components (i.e. baseboard, heatsink assembly, etc.) that have
not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/
memory test. The stress test should be then followed by a visual inspection and then BIOS/
Processor/memory test.
C.1.2.5 Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
2. Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No
visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with
respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test of post-test samples.
6. Thermal compliance testing to demonstrate that the case temperature specification can be met.
C.1.2.6 Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental stresses, with
the thermal mechanical enabling components assembled. The test shall be conducted on a fully
operational baseboard that has not been exposed to any battery of tests prior to the test being
considered.
Testing setup should include the following components, properly assembled and/or connected:
• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the checking of BIOS,
basic processor functions and memory, without any errors. Intel PC Diags is an example of
software that can be utilized for this test.
C.1.3 Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose
materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic
materials such as PVC formulations, certain polyurethane compositions (e.g. polyester and some
polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes
also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-
810E, Method 508.4 must be performed to determine material performance.