64-bit Intel Xeon Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines

Thermal/Mechanical Reference Design
34 64-bit Intel® Xeon™ Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines
when the baseboard is pushed down upon it. This spring does not function as a clip of any kind.
The two tabs on the spring are used to provide the necessary compressive preload for the TIM
when the whole solution is assembled. The tabs make contact on the secondary side of the
baseboard. In order to avoid damage to the contact locations on the baseboard, the tabs will be
insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent). Figure 2-15 shows an
isometric view of the CEK spring design.
Please refer to Appendix A for more detailed mechanical drawings of the CEK spring. Also, the
baseboard keepout requirements shown in Appendix A must be met to use this CEK spring design.
2.4.8 Boxed Active Thermal Solution for the 64-bit Intel
®
Xeon™
Processor with 2MB L2 Cache
• In addition to the 1U and 2U passive CEK heatsinks, Intel is developing an active heatsink
solution. This heatsink solution is primarily designed to be used in a pedestal chassis where
sufficient air inlet space is present and side directional airflow is not an issue. All three
heatsinks will be offered as part of boxed 64-bit Intel Xeon Processor with 2MB L2 Cache
products. These solutions are intended for system integrators who build systems from
components available through distribution channels. The retention solution used for these
Figure 2-15. CEK Spring Isometric View
Figure 2-16. Isometric View of CEK Spring Attachment to the Base Board