Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Thermal/Mechanical Reference Design
30 Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines
2.4.6 Thermal Profile Adherence
The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the
Dual-Core Intel Xeon processor 2.80 GHz. From Table 2-2, the three-sigma (mean+3sigma)
performance of the thermal solution is computed to be 0.234 °C/W and the processor local ambient
temperature (T
LA
) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this
thermal solution is calculated as:
Equation 2-8. y = 0.234x + 40
where,
y = Processor T
CASE
value (°C)
x = Processor power value (W)
Figure 2-11 below shows the comparison of this reference thermal solution’s Thermal Profile to the
Dual-Core Intel Xeon processor 2.80 GHz Thermal Profile A specification. The 2U+ CEK solution
meets the Thermal Profile A with a 0.4 °C margin at the lower end (Pcontrol_base_A) and a 0.4 °C
margin at the upper end (TDP). By designing to Thermal Profile A, it is ensured that no measurable
performance loss due to TCC activation is observed under the given environmental conditions.
Figure 2-10. 1U CEK Heatsink Thermal Performance
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0 1020304050
CFM Through Fins
Ψ
ca
, C/W
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
∆
P, inch water
Mean
Ψ
ca
= 0.1481 + 1.0692*CFM
-0.8135
σ
= 0.008 C/W
∆
P = 6.12e-04CFM
2
+ 1.59e-02CFM
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0 1020304050
CFM Through Fins
Ψ
ca
, C/W
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
∆
P, inch water
Mean
Ψ
ca
= 0.1481 + 1.0692*CFM
-0.8135
σ
= 0.008 C/W
∆
P = 6.12e-04CFM
2
+ 1.59e-02CFM