Intel Xeon processor LV Thermal Design Guide

Dual-Core Intel
®
Xeon
®
processor LV and ULV
Thermal Design Guide August 2006
4 311374-002
5 Package Dimensions (Front View)...............................................................................12
6 Dimension Information for Package.............................................................................13
7 Package Dimensions (Top and Side View: Two of Two) ..................................................14
8 Package Dimensions (Bottom View: Two of Two) ..........................................................15
9 Board Level Primary Side Keep-Out Zone Requirements.................................................18
10 Board Level Secondary Side Keep-Out Zone Requirements.............................................19
11 Processor Thermal Characterization Parameter Relationships..........................................21
12 AdvancedTCA* Reference Heatsink Assembly ...............................................................24
13 AdvancedTCA* Reference Heatsink Thermal Performance vs. Volumetric Airflow Rate........25
14 1U Reference Heatsink Assembly................................................................................26
15 1U Reference Heatsink Thermal Performance versus Volumetric Airflow Rate....................27
16 Thermal Modeling Method Flow Chart..........................................................................31
17 Example of Thermal Modeling Results Showing the Temperature of the Heatsink Base .......33
18 AdvancedTCA* Reference Heatsink PCB Keep-Out Zone Requirements: One of Two...........37
19 AdvancedTCA* Reference Heatsink PCB Keep-Out Zone Requirements: Two of Two...........38
20 AdvancedTCA* Reference Heatsink Assembly Drawing...................................................39
21 AdvancedTCA* Reference Heatsink Drawing.................................................................40
22 1U Reference Heatsink PCB Keep-Out Zone Requirements: One of Two............................41
23 1U Reference Heatsink PCB Keep-Out Zone Requirements: Two of Two............................42
24 1U Reference Heatsink Assembly Drawing....................................................................43
25 1U Reference Heatsink Drawing..................................................................................44
Tables
1 Definition of Terms.................................................................................................... 7
2 Thermal Design Power (TDP) Specifications..................................................................16
3 Required Heatsink Thermal Performance (Ψ
JA
) ............................................................22
4 Reliability Requirements............................................................................................30
5 Recommended Ψ
JS
Values for the Reference Thermal Interface Material..........................32
6 Reference Heatsink...................................................................................................35
7 Mechanical Drawing List ............................................................................................36