603 Pin Socket Design Guidelines

1. Introduction

1.1. Objective:

This document defines a ZIF (Zero Insertion Force) socket intended for workstation and server

platforms based on future Intel microprocessors. The socket provides I\O, power and ground contacts.

The socket must be low cost, low risk, robust, high volume manufacturable (HVM), and multi-

sourceable. The socket has 603 contacts with solder balls/surface mount features for surface mounting

with the motherboard. The 603 Pin Socket contacts have 50mil pitch with regular pin array, to mate

with 603 pins on the Intel Xeon processor package.

1.2. Purpose:

To define functional, quality, reliability, and material (that is, visual, dimensional and physical)

requirements and design guidelines of the 603 Pin Socket. To provide a 603 Pin Socket which meets or

exceeds applicable standards and Intel manufacturing criteria. The 603 Pin Socket must be surface

mountable and meet all the reliability requirements.

1.3. Scope:

This design guideline applies to all 603-pin ZIF sockets purchased to the requirements of this design

guideline.