603 Pin Socket Design Guidelines

603 Pin Socket Design Guidelines
R
27
Typical examples of significant changes include, but are not limited to, the following: Plastic
material changes including base material or color; contact changes including base material, plating
material or thickness; and design modifications.
6.7. Quality Assurance Requirements:
The OEM’s will work with the socket supplier(s) they choose to ensure socket quality.
6.8. Socket Test Plan:
6.8.1. Submission of a 603 Pin Socket for Socket Validation Testing:
The socket supplier's 603 Pin Socket will be sent to Intel's independent test facility for socket validation
testing. The sockets submitted must be per the drawing required in Section 6.4. Refer to Sections 6.11 and
6.12 for production lot definition and number of samples required for validation testing.
6.9. Mechanical Samples:
A mechanical sample of 603 Pin Socket, package, and heat sink (or suitable mockups that approximate size
and mass of the planned heat sink) will be used during the mated socket validation testing. The
recommended maximum mass for 603 Pin Socket package heat sink is 450 g. See data sheet and related
documentation for further information on heat sinks, thermal solutions and mechanical support.
6.10. Socket Validation Notification:
Upon completion of the testing and receipt of test data, Intel and/or the Intel designated test facility will
prepare a summary report for the socket supplier and Intel that will provide notification as to whether
the socket has passed or failed socket validation testing.
6.11. Production Lot Definition:
A production lot is defined as a separate process run through the major operations including molding,
contact stamping, contact plating and assembly. These lots should be produced on separate shifts or
days of the week. Lot identification marking needs to be provided to Intel as verification of this
process.
6.12. Socket Validation:
Socket validation must meet or exceed all guidelines called out in this spec which include: Visual
Inspection, CTF Dimensional Verification, Electrical Resistance, Loop Inductance, Pin to Pin
Capacitance, Contact Current Rating, Dielectric Withstand Voltage, Insulation, Durability, Porosity,
Plating Thickness, Solvent Resistance (If Applicable), Solderability (Applicable for leaded sockets),
Post Reliability Visual and use conditions. The use conditions target failure rates are <1% at 7 years and
<3% at 10 years. Statistical sample sizes, taken randomly from multiple lots, for each test is required.