603 Pin Socket Design Guidelines

603 Pin Socket Design Guidelines
R
15
Dimension Index Minimum mm Maximum mm
Solder Ball 0.20
True Position of Balls N/A 0.41
True Position of Lead / Surface Mount Feature (X,Y) N/A 0.41
Actuation Distance (Cover Travel) N/A 1.52
Cover Thickness Design Specific Design Specific
Cover Hole Diameter (Must guarantee ZIF) Design Specific Design Specific
Cover Hole Virtual Condition (Pattern Locating) 0.30 N/A
Cover Hole Virtual Condition (Feature Relating) Design Specific N/A
Contact Gap Design Specific Design Specific
Contact True Position Design Specific Design Specific
Base Flatness Design Specific Design Specific
Through Cavity Y 13.21 N/A
Through Cavity X 14.22 N/A
Au Location Design Specific Design Specific
Au Thickness 76.2 µmm N/A
Ni Thickness 127 µmm N/A