Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines 35
Thermal/Mechanical Reference Design
2.4.7.3 CEK Spring
The CEK spring, which is attached on the secondary side of the baseboard, is made from 0.80 mm
[0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from
a similar material. The CEK spring has four embosses which, when assembled, rest on the top of
the chassis standoffs. The CEK spring is located between the chassis standoffs and the heatsink
standoffs. The purpose of the CEK spring is to provide compressive preload at the TIM interface
when the baseboard is pushed down upon it. This spring does not function as a clip of any kind.
The two tabs on the spring are used to provide the necessary compressive preload for the TIM
when the whole solution is assembled. The tabs make contact on the secondary side of the
baseboard. In order to avoid damage to the contact locations on the baseboard, the tabs will be
insulated with a 0.127 mm [0.005 in.] thick Kapton* tape (or equivalent). Figure 2-15 shows an
isometric view of the CEK spring design.
Please refer to Appendix A for more detailed mechanical drawings of the CEK spring. Also, the
baseboard keepout requirements shown in Appendix A must be met to use this CEK spring design.
Figure 2-15. CEK Spring Isometric View
Figure 2-16. Isometric View of CEK Spring Attachment to the Base Board
Primary
Secondary
Secondary Primary