Intel Xeon processor LV Thermal Design Guide

Dual-Core Intel
®
Xeon
®
processor LV and ULV
August 2006 Thermal Design Guide
311374-002 25
Reference Thermal Solutions
6.3 AdvancedTCA* Reference Heatsink
The reference thermal solution compatible with the AdvancedTCA* form factor is
designed assuming a maximum ambient temperature (as measured outside the
chassis) of 40 °C with a minimum volumetric airflow rate through the AdvancedTCA slot
of 30 CFM. Assuming these boundary conditions are met, the reference thermal
solutions will meet the thermal specifications for both the 15 W and 31 W processor.
Furthermore, the AdvancedTCA reference heatsink is suitable for dual-processor
configurations. Section 6.7 provides further guidance to optimize the component
placement to enable the dual processor configuration.
Note: The AdvancedTCA reference heatsink is suitable for the 15 W Processor. It is also
suitable for the 31 W Processor if the system is properly designed. For example,
Figure 14 illustrates optimal processor placement on a PCB to ensure that both
processors receive cool (not preheated) airflow. This enables the heatsinks to dissipate
the same amount of power on each processor. The platform designer must determine
the processor cooling limitations for their specific designs and decide if the 31 W
processor can be cooled.
Figure 13. CompactPCI* Reference Heatsink Thermal Performance vs. Volumetric Airflow
Rate