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Intel Xeon processor LV Thermal Design Guide

ManualsBrandsIntel ManualsOtherIntel Xeon Processor 2.66 GHz, 512K Cache, 533 MHz FSB
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Dual-Core Intel
®
Xeon
®
processor LV and ULV
August 2006 Thermal Design Guide
311374-002 23
Reference Thermal Solutions
6.0 Reference Thermal Solutions
Intel has developed reference thermal solutions designed to meet the cooling needs of
the processor in embedded form factor applications. This chapter describes the overall
requirements for the reference thermal solution including critical-to-function
dimensions, operating environment, and verification criteria. This document details
solutions that are compatible with the CompactPCI*, AdvancedTCA*, and Server
System Infrastructure (1U and larger) form factors.
The heatsinks are attached to the board using a screw, spring and back plate assembly.
The heatsink uses the fastener assembly (refer to Section 6.2) to mount to the PCB.
Detailed drawings of this heatsink are provided in Appendix B, “Mechanical Drawings”.
Figure 11 illustrates an example of the thermal solution assembly. Full mechanical
drawings of the thermal solutions and the corresponding heatsink clip are provided in
Appendix B, “Mechanical Drawings”. Appendix A, “Thermal Solution Component
Suppliers” contains vendor information for each thermal solution component.
6.1 CompactPCI* Reference Heatsink
The reference thermal solution compatible with the CompactPCI* form factor is
designed assuming a maximum ambient temperature (as measured outside the
chassis) of 40 °C with a minimum volumetric airflow rate through each slot of 10 CFM.
Assuming these boundary conditions are met, the reference thermal solutions will meet
the thermal specifications for the ULV Processor.
Note: The CompactPCI* reference heatsink may not be suitable for the 31 W Processor.
6.2 Mechanical Design
The reference heatsink is shown in Figure 12. The maximum component height is
13.716 mm, so the maximum heatsink height is constrained to 8.68 mm. The heatsink
uses the fastener assembly (refer to Section 6.2) to mount to the PCB. Detailed
drawings are provided in the Appendix B, “Mechanical Drawings”.