64-bit Intel Xeon Processorwith up to 8MB L3 Cache Thermal/Mechanical Design Guidelines

Thermal/Mechanical Reference Design
R
22 64-bit Intel
®
Xeon™ Processor MP with 8 MB L3 Cache
Thermal/Mechanical Design Guidelines
Figure 2-9. 2U+ Cooling Solution Heatsink Thermal Performance
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0 20 40 60 80 100 120
CFM Through Fins
≅
ca
, C/W
≅
P, inch water
≅
ca
= 0.1835 + 1.2225*CFM
-0.9397
≅
= 0.0024 C/W, non-uniform heat
≅
P Test = 5.52e-05CFM
2
+ 5.24e-03CFM
If other custom heatsinks are intended for use with the 64-bit Intel Xeon processor MP with up to
8 MB L3 cache, they must support the following interface control requirements to be compatible
with the reference mechanical components:
• Requirement 1: Heatsink assembly must stay within the volumetric keep-in.
• Requirement 2: Maximum mass and center of gravity.
Current maximum heatsink mass is 1000 grams [2.2 lbs] and the maximum center of gravity 3.81
cm [1.5 in.] above the bottom of the heatsink base.
• Requirement 3: Maximum and minimum compressive load.
Any custom thermal solution design should meet the loading specification as documented within
this document, and should refer to the datasheet for specific details on package loading
specifications.
2.4.6 Structural Considerations of Cooling Solution
As Intel explores methods of keeping thermal solutions within the air-cooling space, the mass of the
thermal solutions is increasing significantly. Due to the flexible nature (and associated large
deformation) of baseboard-only attachments, Intel reference solutions, such as cooling solution, are
now commonly using direct chassis attach (DCA) as the mechanical retention design. The mass of
the new thermal solutions is large enough to require consideration for structural support and
stiffening on the chassis. Intel has published a best know method (BKM) document that provides
specific structural guidance for designing DCA thermal solutions. The document is titled Chassis
Strength and Stiffness Measurement and Improvement Guidelines for Direct Chassis Attach
Solutions.