64-bit Intel Xeon Processorwith up to 8MB L3 Cache Thermal/Mechanical Design Guidelines

R
64-bit Intel
®
Xeon™ Processor MP with 8 MB L3 Cache 7
Thermal/Mechanical Design Guidelines
1 Introduction
1.1 Objective
The purpose of this guide is to describe the reference thermal solution and design parameters
required for the 64-bit Intel
®
Xeon™ processor MP with up to 8 MB L3 cache. It is also the intent
of this document to comprehend and demonstrate the processor cooling solution features and
requirements. Furthermore, this document provides an understanding of the processor thermal
characteristics, and discusses guidelines for meeting the thermal requirements imposed on the entire
life of the processor. The thermal/mechanical solutions described in this document are intended to
aid component and system designers to develop and evaluate a processor compatible solution.
1.2 Scope
The thermal/mechanical solutions described in this document pertain only to a solution(s) intended
for use with the 64-bit Intel Xeon processor MP with up to 8 MB L3 cache in 2U+ form factor
systems. This document contains the mechanical and thermal requirements of the processor (or
processor family) cooling solution. In case of conflict, the data in the 64-bit Intel
®
Xeon™
Processor MP with up to 8 MB L3 Cache Datasheet supersedes any data in this document.
Additional information is provided as a reference in the appendix section(s).
1.3 References
Material and concepts available in the following documents may be beneficial when reading this
document.
Document Comment
64-bit Intel
®
Xeon™ Processor MP with up to 8 MB L3 Cache Datasheet
http://developer.intel.com
mPGA604 Socket Design Guidelines
http://developer.intel.com
64-bit Intel
®
Xeon™ Processor MP with up to 8 MB L3 Cache Processor
Cooling Solution Mechanical Models
http://developer.intel.com
64-bit Intel
®
Xeon™ Processor MP with up to 8 MB L3 Cache Mechanical
Models
http://developer.intel.com
64-bit Intel
®
Xeon™ Processor MP with up to 8 MB L3 Cache Thermal
Test Vehicle and Cooling Solution Thermal Models
http://developer.intel.com
European Blue Angel Recycling Standards http://www.blauer-engel.de
Thin Electronics Specification (Server System Infrastructure (SSI)
Specification) for Rack Optimized Servers
www.ssiforum.com
NOTE: Contact your Intel field sales representative for the latest revision and order number of this document.