603 Pin Socket Design Guidelines

Figures

Figure 3-1: Typical Reflow Profile for 63Sn/37Pb solder.........................................................14

Figure 4-1: Methodology for Measuring Total Electrical Resistance....................................... 17

Figure 4-2: Methodology for Measuring Electrical Resistance of the Jumper.........................17

Figure 4-3: Electrical Resistance Fixtures superimposed....................................................... 18

Figure 4-4: Inductance Measurement Fixture Cross-Section .................................................21

Figure 4-5: Inductance and Capacitance Fixture ....................................................................21

Figure 5-1: Flow chart of Knowledge-based Reliability Evaluation Methodology ....................24

Figure 9-1. - Appendix A.1 Interposer pin array ......................................................................32

Figure 9-2. - Appendix A.2 Interposer drawing........................................................................33

Figure 9-3. - Appendix A.3 603 Pin Processor pin field Pin Details .......................................34

Figure 9-4. - Appendix A.4 Socket Drawing ............................................................................35

Figure 9-5. - Appendix A.5 Socket Drawing ............................................................................36

Figure 9-6. - Appendix A.6 603 Pin Socket Keep-In Zone ......................................................37

Tables

Table 2-1: Package Critical To Function (CTF) Dimensions.....................................................8

Table 3-1: Socket Critical To Function Dimensions ................................................................14

Table 4-1: Electrical Requirements for Sockets...................................................................... 16

Table 4-2: Definitions ..............................................................................................................16

Table 4-3 19

Table 5-1: Use conditions environment................................................................................... 24