603 Pin Socket Design Guidelines

3. Mechanical Requirements

3.1. Pin-Out and Orientation Diagram:

The pin-out for the 603 Pin Socket is shown in Figure 9-2 (Appendix A.2). This diagram is viewed

from the TOP of the SOCKET

3.2. Mechanical Supports:

A retention system needs to isolate any load in excess of 50lbf, compressive, from the socket during the

shock and vibration conditions outlined in Sections 5. The socket must pass the mechanical shock and

vibration requirements listed in Sections 5 with the associated heatsink and retention mechanism

attached. Socket can only be attached by the 603 contacts to the motherboard. No external (i.e. screw,

extra solder. adhesive....) methods to attach the socket are acceptable

3.3. Materials:

3.3.1. Socket Housing:

Thermoplastic or equivalent, UL 94V-0 flame rating, temperature rating and design capable of

withstanding the reflow solder process per Section 3.6.2.

3.3.2. Color:

The color of the socket can be optimized to provide the contrast needed for OEM’s pick and place

vision systems. The base and cover of the socket may be different colors as long as they meet the above

requirement.

3.3.3. Markings:

3.3.3.1. Name:

603 Pin Socket (Font type is Helvetica - 16 point Bold).

This mark shall be molded or Laser Marked into the processor side of the socket housing.

Manufacturer’s insignia (font size at supplier’s discretion).

This mark will be molded or Laser Marked into the socket housing. Both marks must be visible when

first seated in the motherboard. The marks must withstand the reflow solder process of Section 5.4 and

the solvent resistance test in of Section 5.3. Any requests for variation from this marking requires a

written description (detailing size and location) to be provided to Intel for approval.