64-bit Intel Xeon Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines

64-bit Intel® Xeon™ Processor with 2MB L2 Cache Thermal/Mechanical Design Guidelines 67
D Enabled Suppliers Information
D.1 Supplier Information
D.1.1 Intel Enabled Suppliers
The Intel reference solutions have been verified to meet the criteria outlined in Section D.1.
Customers can purchase the Intel reference thermal solution components from the suppliers listed
in Table D-1.
To meet Thermal Profile B in 1U rack optimized servers, the Intel 64-bit Intel Xeon Processor with
2MB L2 Cache Reference Design (CEK604-1U-02) was optimized for thermal performance, while
maintaining similar pressure drop characteristics as the Intel
®
Xeon™ Processor with 800 MHz
System Bus Reference Design. Performance optimization involved modifications to the base
thickness and fin density. For additional details, please refer to the 64-bit Intel Xeon Processor with
2MB L2 Cache drawings in Appendix A, and to the Intel
®
Xeon™ Processor with 800 MHz System
Bus Thermal/Mechanical Design Guidelines.
Table D-1. Suppliers for the 64-bit Intel(R) Xeon(TM) Processor with 2MB L2 Cache Intel
Reference Solution
Assembly Component Description
Development
Suppliers
Supplier Contact Info
CEK604-2U-01
(for 2U, 2U+)
CEK Heatsink Copper Fin,
Copper Base
Fujikura*
CNDA 36187
(stacked fin)
Furukawa*
CNDA 65755
(crimped fin)
Mechatronics*
Steve Carlson
800-453-4569 x205
[e-mail]
Furukawa America*
Katsu Mizushima
[phone]
[e-mail]
Thermal Interface
Material
Grease Shin-Etsu G751
CNDA 75610
Donna Hartigan
[phone]
CEK Spring Stainless Steel
301, Kapton*
Tape on Spring
Fingers
ITW Fastex*
CNDA 78538
AVC*
CNDA 2085011
Foxconn*
CNDA 11251
Ron Schmidt
[phone]
[e-mail]
Felicia Lee
886-2-22996390 x144
[e-mail]
CEK604-1U-02
(for 1U)
CEK Heatsink Copper Fin,
Copper Base
Fujikura*
CNDA 36187
(stacked fin)
Mechatronics*
Steve Carlson
800-453-4569 x205
[e-mail]
Thermal Interface
Material
See CEK604-2U-01
CEK Spring See CEK604-2U-01