Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Thermal/Mechanical Reference Design
32 Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines
2.4.7 Components Overview
2.4.7.1 Heatsink with Captive Screws and Standoffs
The CEK reference heatsink uses snapped-fin technology for its design. It consists of a copper base
and copper fins with Shin-Etsu G751* thermal grease as the TIM. The mounting screws and
standoffs are also made captive to the heatsink base for ease of handling and assembly as shown in
Figure 2-13 and Figure 2-14 for the 2U+ and 1U heatsinks, respectively.
Figure 2-12. 1U CEK Thermal Adherence to Dual-Core Intel Xeon Processor 2.80 GHz
Thermal Profile B
0
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0 102030405060708090100110120130140150
Power [W]
Tcase [°C]
T
CASE MAX_B
@
TDP
T
CASE MAX_B
@
P
CONTROL_BASE
P
CONTROL_BASE
TDP
1U CEK Reference Solution
y=0.290*x+40
Thermal Profile B
y=0.261*x+44
0
10
20
30
40
50
60
70
80
90
0 102030405060708090100110120130140150
Power [W]
Tcase [°C]
T
CASE MAX_B
@
TDP
T
CASE MAX_B
@
P
CONTROL_BASE
P
CONTROL_BASE
TDP
1U CEK Reference Solution
y=0.290*x+40
Thermal Profile B
y=0.261*x+44