Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines 67
Quality and Reliability Requirements D
D.1 Intel Verification Criteria for the Reference Designs
D.1.1 Reference Heatsink Thermal Verification
The Intel reference heatsinks will be verified within specific boundary conditions based on the
methodology described in Appendix B.1, and using a TTV.
The test results, for a number of samples, are reported in terms of a worst-case mean + 3σ value for
thermal characterization parameter using real processors (based on the TTV correction offset).
D.1.2 Environmental Reliability Testing
D.1.2.1 Structural Reliability Testing
Structural reliability tests consist of unpackaged, board-level vibration and shock tests of a given
thermal solution in assembled state, as well as long-term reliability testing (temperature cycling,
bake test). The thermal solution should be capable of sustaining thermal performance after these
tests are conducted; however, the conditions of the tests outlined here may differ from the
customers’ system requirements.
D.1.2.2 Random Vibration Test Procedure
•
Duration: 10 min/axis, 3 axes
• Frequency Range: 5 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 G RMS (refer to Figure D-25)