Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines 3
Contents
1 Introduction.........................................................................................................................7
1.1 Objective ...............................................................................................................7
1.2 Scope .................................................................................................................... 7
1.3 References............................................................................................................7
1.4 Definition of Terms ................................................................................................8
2 Thermal/Mechanical Reference Design ...........................................................................11
2.1 Mechanical Requirements................................................................................... 11
2.1.1 Processor Mechanical Parameters ........................................................ 11
2.1.2 Intel® Xeon™ Processor with 800 MHz System Bus Package.............. 12
2.1.3 Intel® Xeon™ Processor with 800 MHz System BusConsiderations.....14
2.2 Thermal Requirements........................................................................................15
2.2.1 Thermal Profile ....................................................................................... 15
2.2.2 TCONTROL Definition............................................................................ 16
2.2.3 Dual Thermal Profile Concept for the Intel® Xeon™ Processor with
800 MHz System Bus.............................................................................18
2.2.4 Performance Targets..............................................................................19
2.2.5 Altitude ...................................................................................................19
2.3 Characterizing Cooling Solution Performance Requirements .............................19
2.3.1 Fan Speed Control .................................................................................19
2.3.2 Processor Thermal Characterization Parameter Relationships .............21
2.3.3 Chassis Thermal Design Considerations ...............................................23
2.4 Thermal/Mechanical Reference Design Considerations .....................................24
2.4.1 Heatsink Solutions..................................................................................24
2.4.2 Thermal Interface Material .....................................................................24
2.4.3 Summary ................................................................................................25
2.4.4 Assembly Overview of the Intel Reference Thermal
Mechanical Design ................................................................................. 25
2.4.5 Thermal Solution Performance Characteristics......................................27
2.4.6 Thermal Profile Adherence.....................................................................28
2.4.7 Components Overview ...........................................................................30
2.4.8 Reference Active Thermal Solution for the
Intel® Xeon™ Processor with 800 MHz System Bus34
2.4.9 Active Heatsink Weight ..........................................................................34
2.5 Electrical Requirements ......................................................................................35
2.5.1 Fan Power Supply (Active CEK) ............................................................35
2.6 Boxed Processor Contents..................................................................................37
A Mechanical Drawings .......................................................................................................39
B Test Setup Methodology ..................................................................................................59
B.1 Thermal Metrology ............................................................................................. 59
B.1.1 Processor Thermal Solution Performance Assessment.........................59
B.1.2 Thermocouple Attachment, Air Temperature and Velocity
Measurements........................................................................................60
C Safety Requirements........................................................................................................65
D Quality and Reliability Requirements ...............................................................................67