Intel Xeon Processor Specification Update

Intel
®
Xeon
®
Processor Specification Update 17
Identification Information
NOTES:
1. The Intel
®
Xeon
®
processor listed here is installed onto a micro pin grid array (mPGA) interposer. The overall processor
package is called INT-mPGA.
2. These parts are Intel boxed processors.
3. FC-BGA packaging maintains form, fit, and functionality when compared to OLGA packaging. Users may notice a color change.
4. These parts require the inputs from A20M#, IGNNE#, LINT[1]/NMI and LINT[0]/INTR pins during RESET to set the correct core
to bus frequency ratio.
5. These parts are the Intel
®
Xeon
®
Processor with 533 MHz Front Side Bus.
6. These parts have a VID of 1.525V.
7. These parts are the Low Voltage Intel
®
Xeon
®
Processor.
8. These parts are the Intel
®
Xeon
®
Processor with 1-MB L3 Cache.
9. These parts are the Intel
®
Xeon
®
Processor with 2-MB L3 Cache.
SL8TL L0 0F29H 2.40/533 512-KB 01 604-pin micro-PGA
interposer with 42.5 mm
FC-PGA2 package
5
2
SL8SE L0 0F29H 2/400 512-KB 01 604-pin micro-PGA
interposer with 42.5 mm
FC-PGA2 package
7
SL8TH L0 0F29H 1.60/400 512-KB 01 604-pin micro-PGA
interposer with 42.5 mm
FC-PGA2 package
7
Table 1. Intel
®
Xeon
®
Processor Identification and Package Information (Sheet 5 of 5)
S-Spec
Number
Core
Stepping
Processor
Signature
Speed
Core/Front
Side Bus
(GHz/MHz)
L2 Size
(Kbytes)
L3 Size
(Kbytes)
Processor
Interposer
Revision
Package and
Revision
Notes