Intel Xeon processor LV Thermal Design Guide

Reference Thermal Solutions
Dual-Core Intel
®
Xeon
®
processor LV and ULV
Thermal Design Guide August 2006
24 Reference Number: 311374-002
6.2.1 Keep-Out Zone Requirements
The keep-out zone requirements on the PCB to use this heatsink are detailed in
Appendix A, “Reference Heatsink”. It is critical for the board designer to allocate space
on the board for the heatsink since it extends beyond the footprint of the socket.
6.2.2 Thermal Performance
The CompactPCI* reference heatsink should be made from copper to achieve the
necessary thermal performance. Based on the boundary conditions stated (ambient
temperature = 40 °C), the heatsink will meet the thermal performance needed to cool
ULV Processor in the CompactPCI* form factor. The heatsink performance versus
volumetric airflow rate is shown in Figure 13.
The system integrator can make trade-offs to determine the best heatsink material to
use based on usage conditions. For example, a higher ambient temperature might be
considered with use of the copper heatsink.
Figure 12. CompactPCI* Reference Heatsink Assembly