Intel Xeon processor LV Thermal Design Guide

Thermal Specifications

Dual-Core Intel

Xeon

processor LV and ULV

Thermal Design Guide August 2006

16 Reference Number: 311374-002

3.0 Thermal Specifications

3.1 Thermal Design Power

The Thermal Design Power (TDP) specification is listed in Table 2. Heat transfer through

the micro FCPGA package and into the base board is negligible. The cooling capacity

without a thermal solution is also limited, so Intel recommends the use of a heatsink

for all usage conditions.

3.2 Maximum Allowed Component Temperature

The device must maintain a maximum temperature at or below the value specified in

Table 2. The thermal solution is required to meet the temperatures specification while

dissipating the Thermal Design Power. Section 5.0 includes guidelines for accurately

measuring the package temperature.

Table 2. Thermal Design Power (TDP) Specifications

Component Parameter Maximum Notes

Dual-Core Intel

Xeon

processor LV

and ULV

JUNCTION MAX

100 °C

Maximum allowed component temperature

during operation.

Dual-Core Intel

Xeon

processor LV

and ULV

JUNCTION MIN

0 °C

Minimum allowed component temperature

during operation.

Dual-Core Intel

Xeon

processor ULV

at 1.66 GHz

TDP 15 W

Dual-Core Intel

Xeon

processor LV at

2.0 GHz and 1.66 GHz

TDP 31 W