Intel Xeon Processor 2.80 GHz Thermal/Mechanical Design Guidelines

Thermal/Mechanical Reference Design
12 Dual-Core Intel
®
Xeon
®
Processor 2.80 GHz Thermal/Mechanical Design Guidelines
2.1.2 Dual-Core Intel® Xeon® Processor 2.80 GHz Package
The Dual-Core Intel® Xeon® processor 2.80 GHz is packaged using the flip-chip micro pin grid
array 4 (FC-mPGA4) package technology. Please refer to the Dual-Core Intel® Xeon® Processor
2.80 GHz Datasheet for detailed mechanical specifications. The Dual-Core Intel Xeon processor
2.80 GHz Mechanical drawing, Figure 2-1, provides the mechanical information for Dual-Core
Intel Xeon processor 2.80 GHz. The stack up height of the processor in the socket is shown in
Appendix A. The drawing is superseded with the drawing in the processor datasheet, should there
be any conflicts.