Intel Xeon Processor with 800 MHz System Bus Thermal/Mechanical Design Guide

8 Intel® Xeon™ Processor with 800 MHz System Bus Thermal/Mechanical Design Guidelines
Introduction
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1.4 Definition of Terms
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ntel® Xeon™ Processor with 800 MHz System Bus Enabled
Components Thermal Models
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Table 1-1. Reference Documents
Document Comment
Table 1-2. Terms and Descriptions
Term Description
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
FMB
Flexible Motherboard Guideline: an estimate of the maximum value of a processor
specification over certain time periods. System designers should meet the FMB values
to ensure their systems are compatible with future processor releases.
FSC Fan Speed Control
IHS
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
mPGA604
The surface mount Zero Insertion Force (ZIF) socket designed to accept the Intel Xeon
Processor with 800 MHz System Bus.
Offset
A value programmed into each processor during manufacturing that can be obtained by
reading the IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique
value.
P
MAX
The maximum power dissipated by a semiconductor component.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T
CASE
– T
S
) / Total
Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor, measured at the geometric center of the
topside of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation when the die temperature is very near its operating limits.
T
CONTROL
A processor unique value, which defines the lower end of the Thermal Profile and is
targeted to be used in fan speed control mechanisms.