603 Pin Socket Design Guidelines

603 Pin Socket Design Guidelines
R
3
Contents
1.
Introduction................................................................................................................................... 6
1.1. Objective:......................................................................................................................... 6
1.2. Purpose: .......................................................................................................................... 6
1.3. Scope:.............................................................................................................................. 6
2. Processor Pin Field Description: .................................................................................................. 8
2.1. Processor pin field without Heatsink:............................................................................... 8
2.2. Pin Dimensions:............................................................................................................... 8
3. Mechanical Requirements.......................................................................................................... 10
3.1. Pin-Out and Orientation Diagram: ................................................................................. 10
3.2. Mechanical Supports: .................................................................................................... 10
3.3. Materials: ....................................................................................................................... 10
3.3.1. Socket Housing: .......................................................................................... 10
3.3.2. Color: ........................................................................................................ 10
3.3.3. Markings:..................................................................................................... 10
3.3.3.1. Name: ............................................................................................. 10
3.3.3.2. Lock (closed) and Unlock (open) Markings .................................... 11
3.3.3.3. Lot Traceability:............................................................................... 11
3.3.3.4. Socket Size:.................................................................................... 11
3.3.3.5. Socket/Processor pin field Movement: ........................................... 11
3.3.3.6. Orientation in Packaging and Shipping and Handling:.................... 11
3.3.4. Contact Characteristics: .............................................................................. 11
3.3.4.1. Number of Contacts:....................................................................... 11
3.3.4.2. Base Material: ................................................................................. 11
3.3.4.3. Contact Area Plating: ...................................................................... 12
3.3.4.4. Solder Ball/Surface Mount Feature Attachment Area Plating:........ 12
3.3.4.5. Solder Ball/Surface Mount Feature Characteristics:....................... 12
3.3.4.6. Lubricants: ...................................................................................... 12
3.3.5. Environmental Concerns Requirements:..................................................... 12
3.4. Visual Inspection:........................................................................................................... 12
3.5. Socket Manufacturability Requirements: ....................................................................... 12
3.5.1. Lever Design Requirements........................................................................ 12
3.5.2. Socket Engagement/Disengagement Force:............................................... 12
3.5.3. Visual Aids:.................................................................................................. 13
3.5.4. Equipment Pick and Place:.......................................................................... 13
3.5.5. Solderability Test: ........................................................................................ 13
3.5.6. Socket BGA Co-Planarity: ........................................................................... 13
3.5.7. Solder Ball/Surface Mount Feature True Position: ...................................... 13
3.6. Assembly Requirements to the Motherboard: ............................................................... 13
3.6.1. Surface Mountable: ..................................................................................... 13
3.6.2. Reflow Characteristics:................................................................................ 13
3.6.3. Overall Assembly Sequence: ...................................................................... 14
3.7. Critical To Function Dimensions:................................................................................... 14
4. Electrical Requirements ............................................................................................................. 16
4.1. Electrical Resistance: .................................................................................................... 17
4.2. Determination of Maximum Electrical Resistance: ........................................................ 20
4.3. Inductance: .................................................................................................................... 20