Vol 1

Intel® Xeon® Product 2800/4800/8800 v2 Product Family 45
Datasheet Volume One, February 2014
Thermal Management Specifications
4.1.3 Intel® Xeon® E7v2 Processor Thermal Profiles
Note: SKUs are subject to change. Please contact your Intel Field Representative to obtain the latest SKU
information.
4.1.3.1 155W Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on initial pre-silicon simulations, which will be updated as further
characterization data becomes available.
4. Power specifications are defined at all VIDs. The Intel® Xeon® E7v2 processor may be delivered under
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 4-1. Intel® Xeon® E7v2 Processor SKU Summary Table
TDP SKUs
Thermal Profile
Tcase DTS
155W Figure 4-1 Figure 4-2, Figure 4-5, Figure 4-6
130W Figure 4-7 Figure 4-8
105W Figure 4-7 Figure 4-8
Table 4-2. Tcase: 155W Thermal Specifications
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
155 5 See Figure 4-1 and
Table 4-5.
1, 2, 3, 4, 5