Vol 1

Package Mechanical Specifications
164 Intel® Xeon® Product 2800/4800/8800 v2 Product Family
Datasheet Volume One, February 2014
8.6 Processor Mass Specification
The typical mass of the processor is currently up to 50 grams. This mass [weight]
includes all the components that are included in the package.
8.7 Processor Materials
Table 8-3 lists some of the package components and associated materials.
8.8 Processor Markings
Figure 8-4 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Note: XXXXX = Country of Origin
§
Table 8-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Halogen Free, Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 8-4. Processor Top-Side Markings
Legend: Mark Text (Engineering Mark):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES SPEED
GRP1LINE4: XXXXX
GRP1LINE5: {FPO} {e4}
Legend: Mark Text (Production Mark):
GRP1LINE1: i{M}{C}YY
GRP1LINE2: SUB-BRAND PROC#
GRP1LINE3: SSPEC SPEED
GRP1LINE4: XXXXX
GRP1LINE5: {FPO} {e4}