Guide
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 9
Thermal/ Mechanical Specifications and Design Guide
Introduction
1 Introduction
This document provides specifications and guidelines for the design of an Intel®
Xeon® processor E7-2800/4800/8800 v2 product family compatible thermal and
mechanical solutions in 2 and 4-socket Intel® Xeon® processor E7-2800/4800/8800
v2 product family-based platform servers.
1.1 Objective
It is the intent of this document to explain and demonstrate the processor thermal and
mechanical solution features and requirements. This document also provides an
understanding of the processor thermal characteristics, and discusses guidelines for
meeting the thermal requirements imposed on the entire life of the processor. As such,
the purpose of this design guide is to describe the reference thermal solution and
design parameters required for the processor. The thermal/mechanical solutions
described in this document are intended to aid component and system designers in
developing and evaluating processor compatible solutions.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
1.2 Scope
The thermal/mechanical solutions described in this document pertain only to a
solution(s) intended for use with the Intel® Xeon® processor E7-2800/4800/8800 v2
product family in 4U form factor systems. This guide contains the mechanical and
thermal requirements of the processor cooling solution. Thermal profiles and other
processor specifications are provided in the processor datasheet. In case of conflict, the
data in the Intel® Xeon® Processor E7-2800/4800/8800 v2 Product Family Datasheet,
Volume 1 - Electrical, Mechanical, and Thermal Specifications supersedes any data in
this document.
Additional reference information is provided in the appendices of this document. The
components described in this document include:
• The processor package
• The LGA2011-1 socket
• The Independent Loading Mechanism (ILM) and back plate
• The processor thermal solution (heatsink) and associated retention hardware