Guide

Thermal and Mechanical Design
Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family 57
Thermal/ Mechanical Specifications and Design Guide
2.4.5.6.1 Socket Land Pattern
The land pattern for the LGA2011-1 socket is 40 mils hexagonal array. For CTF (Critical
to Function) joints, the pad size will primarily be a circular Metal Defined (MD) pad and
these pads should be designated as a Critical Dimension to the PCB vendors with a
17 mil ±1 mil tolerance. Some CTF pads will have a SMD Pad (20 x 17 mil). For
additional pad configurations details including the NCTF (Non-Critical to Function)
joints, see Section 2.4.5.5.
There is no round-off (conversion) error between socket pitch (1.016 mm) and board
pitch (40 mil) as these values are equivalent.
Figure 2-29. LGA2011-1 Socket Land Pattern (Top View of Board)
Soldermask
SRO Exposing Copper Pad
17 X 20 mil Oblong Partially SMD Pad Overview