Guide

Thermal and Mechanical Design
32 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
The hinge lever and active lever are designed to place equal force on both ends of the
ILM load plate.The frame provides the hinge locations for the levers. The hinge lever
connects the load plate to the frame. When closed, the load plate applies load onto the
IHS at four loading zones. Four point loading contributes to minimizing package and
socket warpage under non uniformly distributed load. The reaction force from closing
the load plate is transmitted to the frame and through the captive fasteners to the back
plate. Some of the load is passed through the socket body to the board inducing a
slight compression on the solder joints.
ILM assembly attaches to motherboard via the back plate and is keyed to the socket
body for proper orientation. ILM holds the heatsink and the back plate all together.
Thermal solution attaches directly to ILM frame as shown in Figure 2-16. Since
heatsink attaches directly to ILM frame, only 4 holes (for ILM) on the motherboard
is required.
Figure 2-15. ILM Assembly (Open Orientation)
ILM Cover
(Bottom View)
Active Lever
Hinge Lever
Load Plate
ILM Frame