Guide
Thermal and Mechanical Design
30 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2. These load limits defines load limits at the beginning of life (BOL) for the Intel’s reference enabling solution
in order to meet the socket End of Life (EOL) loading requirement. Load distribution between HS and ILM
maybe different for custom ILM and heatsink designs. Intel will validate only the stated load distribution.
Customer bears the responsibility of verifying the ILM and HS loads to ensure compliance with the package
and socket loading as well as validating the socket reliability within their system implementation.
3. This is the minimum and maximum static force that can be applied by the heatsink and it’s retention
solution to maintain the interface between the heatsink and the IHS. This does not imply the Intel
reference TIM is validated to these limits.
4. This minimum limit defines the compressive force required to electrically seat the processor onto the socket
contacts.
5. This maximum load limit defines the allowable compressive load by the component.
6. Dynamic loading is defined as heatsink mass (0.6kg) x 50g load superimposed for an 11 ms duration
average on the static load requirement.
7. Conditions must be satisfied at the beginning of life (BOL) and the loading system stiffness for non-
reference designs need to meet a specific stiffness range to satisfy end of life loading requirements.
2.1.5 Independent Loading Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
2011-Land FCLGA package (that is, processor) onto the socket contacts. The ILM is
physically separate from the socket body. The ILM consists of two major components,
the ILM assembly and the back plate, that will be procured as a set from the
enabled vendors.
The installation of the ILM onto the motherboard will occur after the socket is surface
mounted. Insulating materials integrated on both sub assemblies ensure that the PCB
is protected from contact with the ILM components. The exact process step sequence
within the board and system assembly is dependent on customer manufacturing
preference and test flow. See the Manufacturing Advantage Service collateral for this
platform for additional guidance.
The ILM has three critical functions:
• Deliver the force to seat the processor onto the socket contacts
• Distribute the resulting load evenly through the socket solder balls
• Ensure electrical integrity/performance of the socket and package.
2.1.5.1 ILM Overview
The ILM consists of two assemblies, ILM assembly and back plate. The ILM assembly is
installed on the topside of the board via 4 captive fasteners that secure it to the
backplate assembly on the opposite side of the board.
Static compressive load from ILM load plate to
processor IHS BOL
445 N [100 lbf]
712 N [160 lbf] 1, 4, 5, 7
Static compressive load from ILM load plate to
processor IHS EOL
311 N [70 lbf]
Dynamic Load N/A 589 N [132 lbf] 1, 6
TIM2 Activation Pressure 137.9 kPa
Pick and Place Cover Insertion / Removal force N/A 6.2 N
Load Lever actuation force N/A
12.7 N in the vertical
direction
Table 2-7. ILM and Heatsink Mechanical Load Specifications (Sheet 2 of 2)
Parameter Min Max Notes