Guide

Thermal and Mechanical Design
22 Intel® Xeon® Processor E7 2800/4800/8800 v2 Product Family
Thermal/ Mechanical Specifications and Design Guide
2.1.2.3.12 Socket Critical-to-Function Interfaces
Critical-to-function (CTF) dimensions for motherboard layout and assembled
components’ interface to the socket are identified in Table 2-6. The CTF values are
detailed on the socket drawing provided in Appendix F and take precedence over all
values presented in this document. All sockets manufactured must meet the specified
CTF dimensions.
* This feature is a pre-and post-SMT CTF
** This feature is post-SMT only
2.1.2.4 Socket Housing
2.1.2.4.1 Housing Material
The socket housing material should be of thermoplastic or equivalent, UL 94 V-0 flame
rating, temperature rating and design capable of maintaining structural integrity
following a temperature of 260°C for 40 seconds, which is typical of a reflow/rework
profile for solder material used on the socket. The material must have a thermal
coefficient of expansion in the XY plane capable of passing reliability tests rated for an
expected high operating temperature, mounted on HTg FR4-type motherboard
material. The creep properties of the material must be such that the mechanical
integrity of the socket is maintained for the stress conditions outlined in Appendix B.
2.1.2.4.2 Housing Color
The color of the socket housing must be dark as compared to the solder balls to provide
the contrast needed for OEM’s pick and place vision systems. Components of the socket
may be different colors, as long as they meet the above requirement.
2.1.2.4.3 Package Installation/Removal Access
Access must be provided to facilitate the manual insertion and removal of the package.
No tool should be required to install or remove the package from the socket.
Table 2-6. Critical-to-Function Interface Dimensions
Description Sheet/Zone
Socket Package Alignment Cavity Length * Sheet 2, H7
Socket Package Alignment Cavity Width * Sheet 2, F5
Socket Height (from Package Seating Plane to MB after Reflow) ** Sheet 2, B6-7
Seating Plane Co-planarity * Sheet 2, C7
Through Cavity Length Sheet 2, G6
Through Cavity Width Sheet2, F5-6
Through Cavity X-Position Virtual Condition Sheet2, D7-8
Through Cavity Y-Position Virtual Condition Sheet2, F5-6
Stand-Off Gap (Solder Ball to Stand-Off) Sheet2, C6
Solder Ball Pattern Locating True Position Sheet3, B3-4, B1-C2
Solder Ball Feature Relating True Position Sheet3, B3-4, B1-C2
Solder Ball Co-planarity Sheet2, B6
Contact Height Above Seating Plane * Sheet2, B7-8
Contact Pattern Locating True Position * Sheet2, B1-2, C3-4
Contact Feature Relating True Position* Sheet2, B1-2, C3-4
Contact Co-planarity * Sheet2, B7-8