Guidelines

Dual-Core Intel
®
Xeon
®
Processor 7000 Sequence Thermal /Mechanical Guidelines 13
Thermal Mechanical Design
The package includes an integrated heat spreader (IHS). The IHS transfers the non-uniform heat
from the die to the top of the IHS, out of which the heat flux is more uniform and spread over a
larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the
package to an attached cooling device. The IHS is designed to be the interface for contacting a
heatsink. Details can be found in the Dual-Core Intel® Xeon® Processor 7000 Sequence
Datasheet.
Figure 2-2. Dual-Core Intel® Xeon® Processor 7000 Sequence Mechanical Drawing, Sheet 2