Technical Product Specification
Intel® Server Board S2600IP and Intel® Workstation Board W2600CR TPS Design and Environmental Specifications
Revision 1.4 Intel order number G34153-004 113
9. Design and Environmental Specifications
9.1 Products Design Specifications
The following table defines the Intel
®
Server Board S2600IP and Intel
®
Workstation Board
W2600CR operating and non-operating environmental limits. Operation of the Intel
®
Server
Board S2600IP and Intel
®
Workstation Board W2600CR at conditions beyond those shown in
the following table may cause permanent damage to the system. Exposure to absolute
maximum rating conditions for extended periods may affect system reliability.
Table 60. Server Board Design Specifications
Operating Temperature
0º C to 55º C
1
(32º F to 131º F)
Non-Operating Temperature
-40º C to 70º C (-40º F to 158º F)
DC Voltage
± 5% of all nominal voltages
Shock (Unpackaged)
Trapezoidal, 35g , 170 inches/sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Non-Operating Humidity
50% to 90%, non-condensing with a maximum
wet bulb of 28° C (at temperatures from 25° C
to 35° C)
Note:
1.
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel
®
server
building blocks are used together, the fully integrated system will meet the intended thermal requirements of
these components. It is the responsibility of the system integrator who chooses not to use Intel
®
developed
server building blocks to consult vendor datasheets and operating parameters to determine the amount of airflow
required for their specific application and environmental conditions. Intel Corporation cannot be held responsible
if components fail or the server board does not operate correctly when used outside any of its published
operating or non-operating limits.
Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible, if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
9.2 MTBF
The following is the calculated Mean Time Between Failures (MTBF) 30C (ambient air). These
values are derived using a historical failure rate and multiplied by factors for application,