Intel Core2 Duo Processor E8000 and E7000 Series and Intel Pentium Dual-Core Processor E5000 Series Thermal and Mechanical Design Guidelines

Case Temperature Reference Metrology
92 Thermal and Mechanical Design Guidelines
11. While still at the microscope, press the wire down about 6mm [0.125”] from the
thermocouple bead using the tweezers or your finger. Place a piece of Kapton*
tape to hold the wire inside the groove (Figure 7-20). Refer to Figure 7-21 for
detailed bead placement.
Figure 7-20. Position Bead on the Groove Step
Figure 7-21. Detailed Thermocouple Bead Placement
TC Wire with Insulation
IHS with Groove
TC Bead
Wire section
into the
groove to
prepare for
final bead
placement
Kapton*
tape