Intel Core2 Duo Processor E8000 and E7000 Series and Intel Pentium Dual-Core Processor E5000 Series Thermal and Mechanical Design Guidelines

LGA775 Socket Heatsink Loading
Thermal and Mechanical Design Guidelines 71
Figure 7-6. Board Deflection Definition
d1
d2
d’1
d’2
A.3.2 Board Deflection Limits
Deflection limits for the ATX/µATX form factor are:
d_BOL – d_ref≥ 0.09 mm and d_EOL – d_ref ≥ 0.15 mm
And
d’_BOL – d’_ref≥ 0.09 mm and d_EOL’ – d_ref’ ≥ 0.15 mm
NOTES:
1. The heatsink preload must remain within the static load limits defined in the processor
datasheet at all times.
2. Board deflection should not exceed motherboard manufacturer specifications.