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Table of Contents
Overview of Key Architectural Advancements ...................................................3
Higher Performance through Enhanced Thread-Level Parallelism (TLP) ...........................3
Higher Performance through Enhanced Instruction-Level Parallelism (ILP) ........................4
Improvements in Scalability and Headroom ......................................................4
Better Energy Efficiency through Advanced Power and Thermal Management ....................6
Improvements in Reliability, Availability and Serviceability (RAS)..................................6
Manageability: Dynamic Partitioning and Hot Plug Components ..................................10
Future Processor Generations..................................................................11
Conclusion.....................................................................................11
Appendix A: Architectural Overview ............................................................12
Appendix B: Table of RAS Features .............................................................13
Appendix C: Glossary of Useful RAS Terms ......................................................15
About the Authors.............................................................................16
Authors:
Rajesh Agny, Itanium Platform Marketing Manager, Data Center Group, Intel Corporation
Eric DeLano, Senior Principal Engineer, Intel Architecture Group, Intel Corporation
Mohan Kumar, Senior Principal Engineer, Intel Architecture Group, Intel Corporation
Murugasamy (Sammy) Nachimuthu, Lead Server Firmware Architect, Intel Architecture
Group, Intel Corporation
Robert Shiveley, Mission Critical Server Product Manager, Intel Corporation
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White Paper: The Intel® Itanium® Processor 9300 Series