Intel Core Duo Processor and Intel Core Solo Processor on 65 nm Process

Datasheet 3
Contents
1Introduction..............................................................................................................7
1.1 Terminology .......................................................................................................9
1.2 References .........................................................................................................9
2 Low Power Features ................................................................................................11
2.1 Clock Control and Low Power States ....................................................................11
2.1.1 Core Low-Power States ...........................................................................13
2.1.1.1 C0 State..................................................................................13
2.1.1.2 C1/AutoHALT Powerdown State ..................................................13
2.1.1.3 C1/MWAIT Powerdown State ......................................................13
2.1.1.4 Core C2 State...........................................................................13
2.1.1.5 Core C3 State...........................................................................14
2.1.1.6 Core C4 State...........................................................................14
2.1.2 Package Low Power States ......................................................................14
2.1.2.1 Normal State............................................................................ 14
2.1.2.2 Stop-Grant State ......................................................................14
2.1.2.3 Stop Grant Snoop State.............................................................15
2.1.2.4 Sleep State.............................................................................. 15
2.1.2.5 Deep Sleep State......................................................................16
2.1.2.6 Deeper Sleep State...................................................................16
2.2 Enhanced Intel SpeedStep® Technology ..............................................................17
2.3 Extended Low Power States................................................................................18
2.4 FSB Low Power Enhancements............................................................................19
2.5 Processor Power Status Indicator (PSI#) Signal.....................................................19
3 Electrical Specifications...........................................................................................21
3.1 Power and Ground Pins ......................................................................................21
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking......................................................21
3.3 Voltage Identification......................................................................................... 21
3.4 Catastrophic Thermal Protection..........................................................................24
3.5 Signal Terminations and Unused Pins...................................................................25
3.6 FSB Frequency Select Signals (BSEL[2:0])............................................................25
3.7 FSB Signal Groups.............................................................................................25
3.8 CMOS Signals ...................................................................................................27
3.9 Maximum Ratings..............................................................................................27
3.10 Processor DC Specifications ................................................................................ 28
4 Package Mechanical Specifications and Pin Information ..........................................41
4.1 Package Mechanical Specifications....................................................................... 41
4.1.1 Package Mechanical Drawings ..................................................................41
4.1.2 Processor Component Keep-Out Zones......................................................46
4.1.3 Package Loading Specifications ................................................................46
4.1.4 Processor Mass Specifications ..................................................................46
4.2 Processor Pinout and Pin List ..............................................................................47
4.3 Alphabetical Signals Reference............................................................................49
5 Thermal Specifications and Design Considerations ..................................................79
5.1 Thermal Specifications.......................................................................................85
5.1.1 Thermal Diode.......................................................................................85
5.1.2 Thermal Diode Offset..............................................................................87
5.1.3 Intel® Thermal Monitor...........................................................................87
5.1.4 Digital Thermal Sensor (DTS)...................................................................89
5.1.5 Out of Specification Detection ..................................................................90