Datasheet

Datasheet 83
Thermal Specifications and Design Considerations
5 Thermal Specifications and
Design Considerations
Maintaining the proper thermal environment is key to reliable, long-term system
operation. A complete thermal solution includes both component and system level
thermal management features. The system/processor thermal solution should be
designed so that the processor remains within the minimum and maximum junction
temperature (Tj) specifications at the corresponding thermal design power (TDP) value
listed in Ta b l e 2 4 through Tabl e 26.
Caution: Operating the processor outside these limits may result in permanent damage to the
processor and potentially other components in the system.
NOTES:
1. The TDP specification should be used to design the processor thermal solution. The TDP is not the
maximum theoretical power the processor can generate.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents
at higher temperatures and extrapolating the values for the temperature indicated.
Table 23. Power Specifications for the 3x00 Celeron Processors
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit Notes
TDP T1600 1.66 GHz 35 W 1, 4, 5, 6, 9
TDP T1700 1.83 GHz 35 W 1, 4, 5, 6, 9
Symbol Parameter Min Typ Max Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power at HFM V
CC
13.9 W 2, 5, 7
P
SLP
Sleep Power at V
CC
13.1 W 2, 5, 7
P
DSLP
Deep Sleep Power at V
CC
5.5 W 2, 5, 8
T
J
Junction Temperature 0 105 °C3, 4
Table 24. Power Specifications for the Intel Celeron Dual-Core Processor - Standard
Voltage
Symbol
Processor
Number
Core Frequency & Voltage
Thermal Design
Power
Unit Notes
TDP T1600 1.66 GHz 35 W 1, 4, 5, 6, 9
TDP T1700 1.83 GHz 35 W 1, 4, 5, 6, 9
Symbol Parameter Min Typ Max Unit
P
AH,
P
SGNT
Auto Halt, Stop Grant Power at HFM V
CC
13.5 W 2, 5, 7
P
SLP
Sleep Power at V
CC
12.9 W 2, 5, 7
P
DSLP
Deep Sleep Power at V
CC
7.7 W 2, 5, 8
T
J
Junction Temperature 0 100 °C3, 4