Datasheet
Manuals
Brands
Intel Manuals
computer components
T1700
31
32
33
34
35
36
37
38
39
40
Table Of Contents
1 Introduction
1.1 Terminology
1.2 References
2 Low Power Features
2.1 Clock Control and Low Power States
2.1.1 Core Low-Power States
2.1.2 Package Low-Power States
2.2 Enhanced Intel SpeedStep® Technology
2.3 Low-Power FSB Features
2.4 Processor Power Status Indicator (PSI#) Signal
3 Electrical Specifications
3.1 Power and Ground Pins
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking
3.3 Voltage Identification
3.4 Catastrophic Thermal Protection
3.5 Reserved and Unused Pins
3.6 FSB Frequency Select Signals (BSEL[2:0])
3.7 FSB Signal Groups
3.8 CMOS Signals
3.9 Maximum Ratings
3.10 Processor DC Specifications
4 Package Mechanical Specifications and Pin Information
4.1 Package Mechanical Specifications
4.2 Processor Pinout and Pin List
4.3 Alphabetical Signals Reference
5 Thermal Specifications and Design Considerations
5.1 Monitoring Die Temperature
5.1.1 Thermal Diode
5.1.2 Thermal Diode Offset
5.1.3 Intel® Thermal Monitor
5.1.4 Digital Thermal Sensor
5.1.5 Out of Specification Detection
5.1.6 PROCHOT# Signal Pin
Package Mechanical Specifications and Pin Information
38
Datasheet
Figure 7.
SFF (ULV DC) Die Micro-
FCBGA Processor Package Drawing
ø
0.14
A
A
B
L
C
ø
0.04
ø
0.46±0.04
(Metal Diameter)
ø
0.39±0.02
(Solder Resist Opening)
L
1
...
...
36
37
38
39
40
...
...
98
