Datasheet
Manuals
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Intel Manuals
computer components
T1700
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Table Of Contents
1 Introduction
1.1 Terminology
1.2 References
2 Low Power Features
2.1 Clock Control and Low Power States
2.1.1 Core Low-Power States
2.1.2 Package Low-Power States
2.2 Enhanced Intel SpeedStep® Technology
2.3 Low-Power FSB Features
2.4 Processor Power Status Indicator (PSI#) Signal
3 Electrical Specifications
3.1 Power and Ground Pins
3.2 FSB Clock (BCLK[1:0]) and Processor Clocking
3.3 Voltage Identification
3.4 Catastrophic Thermal Protection
3.5 Reserved and Unused Pins
3.6 FSB Frequency Select Signals (BSEL[2:0])
3.7 FSB Signal Groups
3.8 CMOS Signals
3.9 Maximum Ratings
3.10 Processor DC Specifications
4 Package Mechanical Specifications and Pin Information
4.1 Package Mechanical Specifications
4.2 Processor Pinout and Pin List
4.3 Alphabetical Signals Reference
5 Thermal Specifications and Design Considerations
5.1 Monitoring Die Temperature
5.1.1 Thermal Diode
5.1.2 Thermal Diode Offset
5.1.3 Intel® Thermal Monitor
5.1.4 Digital Thermal Sensor
5.1.5 Out of Specification Detection
5.1.6 PROCHOT# Signal Pin
Package Mechanical Specifications and Pin Information
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Datasheet
Figure
3.
4-MB and Fused 2-MB Mic
ro-FCPGA
Processor Package Drawing (Sheet 1 of 2)
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