Datasheet

Datasheet 31
Electrical Specifications
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. V
IL
is defined as the maximum voltage level at a receiving agent that is interpreted as a
logical low value.
3. V
IH
is defined as the minimum voltage level at a receiving agent that is interpreted as a
logical high value.
4. V
IH
and V
OH
may experience excursions above V
CCP
. However, input signal drivers must
comply with the signal quality specifications.
5. This is the pull-down driver resistance. Measured at 0.31*V
CCP
. R
ON
(min) = 0.4*R
TT
, R
ON
(typ) = 0.455*R
TT
, R
ON
(max) = 0.51*R
TT
. R
TT
typical value of 55 Ω is used for R
ON
typ/
min/max calculations.
6. GTLREF should be generated from V
CCP
with a 1%-tolerance resistor divider. The V
CCP
referred to in these specifications is the instantaneous V
CCP
.
7. R
TT
is the on-die termination resistance measured at V
OL
of the AGTL+ output driver.
Measured at 0.31*V
CCP
. R
TT
is connected to V
CCP
on die.
8. Specified with on die R
TT
and R
ON
turned off. Vin between 0 and V
CCP
.
9. Cpad includes die capacitance only. No package parasitics are included.
10. This is the external resistor on the comp pins.
11. On die termination resistance measured at 0.33*V
CCP
.
Table 10. AGTL+ Signal Group DC Specifications
Symbol Parameter Min Typ Max Unit Notes
1
V
CCP
I/O Voltage 1.00 1.05 1.10 V
GTLREF Reference Voltage 2/3 V
CCP
V6
R
COMP
Compensation Resistor 27.23 27.5 27.78 Ω 10
R
ODT
Termination Resistor 55
Ω
11
V
IH
Input High Voltage GTLREF+0.10 V
CCP
V
CCP
+0.10 V 3,6
V
IL
Input Low Voltage -0.10 0 GTLREF-0.10 V 2,4
V
OH
Output High Voltage V
CCP
-0.10 V
CCP
V
CCP
6
R
TT
Termination Resistance 50 55 61
Ω
7
R
ON
Buffer On Resistance 22 25 28
Ω
5
I
LI
Input Leakage Current ±100 µA 8
Cpad Pad Capacitance 1.6 2.1 2.55 pF 9