Server User Manual

Intel® Server Platform SR6850HW4 TPS Table of Contents
Revision 1.0
Intel order number D23151-001
iii
Table of Contents
1. Product Overview.................................................................................................................1
2. System Overview..................................................................................................................3
2.1 System Feature Overview........................................................................................ 3
2.2 Introduction .............................................................................................................. 4
2.3 External Chassis Features - Front ........................................................................... 8
2.3.1 Front Control Panel.................................................................................................. 8
2.3.2 Hot-swap Hard Disk Drive and Peripheral Device Bays .......................................... 9
2.4 External Chassis Features - Rear.......................................................................... 10
2.5 Internal Chassis Features...................................................................................... 11
2.5.1 Server Board Set SE8500HW4 Mainboard............................................................ 11
2.5.2 Server Board Set SE8500HW4 Memory Board ..................................................... 12
2.5.3 Power Distribution Board ....................................................................................... 12
2.5.4 SCSI Backplane Board Board ...............................................................................12
2.5.5 Front Panel I/O Board............................................................................................ 13
2.5.6 Front Panel Control Board ..................................................................................... 13
2.5.7 SATA-to-IDE Converter Board............................................................................... 13
2.5.8 Intel® Management Module................................................................................... 13
2.5.9 Fibre Channel Module ...........................................................................................14
2.5.10 RAID On Motherboard (ROMB) ............................................................................. 14
2.5.11 Power Supply Module............................................................................................ 14
2.5.12 Cooling Subsystem................................................................................................ 16
2.6 New Platform Features ..........................................................................................16
2.6.1 Advanced Memory Performance and Protection ................................................... 16
2.6.2 Rolling BIOS .......................................................................................................... 17
2.7 Server Management .............................................................................................. 17
2.7.1 Intel Management Module (IMM)........................................................................... 17
2.7.2 Hot Swap Controller............................................................................................... 19
2.8 Reliability, Availability, Serviceability, Usability, Manageability (RASUM) ............. 19
2.9 Expansion Support ................................................................................................20
2.10 Specifications......................................................................................................... 21
2.10.1 Environmental Specifications Summary ................................................................ 21
2.10.2 Physical Specifications .......................................................................................... 22