Datasheet

Pentium
®
II Processor at 350 MHz, 400 MHz, and 450 MHz
Datasheet 57
Table 32. Description Table for Processor Markings (S.E.C.C.2 Packaged Processor)
5.3 Processor Package Materials Information
Both the the S.E.C.C. and S.E.C.C.2 processor cartridges are comprised of multiple pieces to make
the complete assembly. This section provides information relevant to the use and acceptance of the
package. Table 33 and Section 34 contain piece-part information of the S.E.C.C. and S.E.C.C.2
processor packages, respectively.
NOTE:
1. Unless otherwise noted, these specifications apply to all S.E.C.C. packaged Pentium
®
II processor frequencies and
cache sizes.
Table 34. S.E.C.C.2 Materials
1
NOTE:
1. Unless otherwise noted, these specifications apply to all S.E.C.C.2 packaged Pentium
®
II processor frequencies and
cache sizes.
Code Letter Descri
p
tion
ALogo
B Product Name
C Trademark
DLogo
E Product Name
F Dynamic Mark Area – with 2-D matrix
Table 33. S.E.C.C. Materials
1
S.E.C.C. Piece Piece Material Maximum Piece Wei
g
ht (Grams)
Extended Thermal Plate Aluminum 6063-T6 84.0
Latch Arms GE Lexan 940-V0, 30% glass filled Less than 2.0 per latch arm
Cover GE Lexan 940-V0 24.0
Total Pentium
®
II Processor 150
S.E.C.C.2 Piece Piece Material Maximum Piece Wei
g
ht (Grams)
Cover GE Lexan 940-V0 18.0
Total Pentium
®
II Processor 57.0