Datasheet

Pentium
®
II Processor at 350 MHz, 400 MHz, and 450 MHz
44 Datasheet
For S.E.C.C.2 packaged processors, no extended thermal plate exists and thermal solutions need to
contact the core package directly and attach through the substrate to the cover. The total processor
power that must be dissipated for S.E.C.C.2 processors can be thought of just as it is for S.E.C.C.
packaged processors: a combination of both the processor core and L2 cache. In regards to the
core, thermal specifications depend on the packaging technology used. Pentium II processors in
S.E.C.C.2 utilizing PLGA core packaging technology have a case temperature specified. Pentium
II processors in S.E.C.C.2 utilizing OLGA core packaging technology have a junction temperature
specified. Specifics on how to measure these two paramaters are outlined in AP-586, Pentium
®
II
Processor Thermal Design Guidelines (Order Number 243331). In addition, there are surface
mounted SRAM components for the L2 Cache on the substrate that have a separate T
CASE
specification in Table 28.
4.1.1 Thermal Diode
The Pentium II processor incorporates an on-die diode that must be used to monitor the die
temperature (junction temperature). A thermal sensor located on the motherboard, or a stand-alone
measurement kit, may monitor the die temperature of the Pentium II processor for thermal
management or instrumentation purposes.Table 29 and Table 30 provide the diode parameter and
interface specifications.
1
NOTES:
1. Not 100% tested. Specified by design characterization.
2. Intel does not support or recommend operation of the thermal diode under reverse bias.
3. At room temperature with a forward bias of 630 mV.
4. n_ideality is the diode ideality factor parameter, as represented by the diode equation:
I-Io(e (Vd*q)/(nkT) - 1).
5.0 S.E.C.C. and S.E.C.C.2 Mechanical S
p
ecifications
Pentium II processors use either S.E.C.C. or S.E.C.C.2 package technology. Both package types
contain the processor core, L2 cache, and other passive components. The cartridges connect to the
motherboard through an edge connector. Mechanical specifications for the processor are given in
this section. See Section 1.1.1 for a complete terminology listing.
Table 29. Thermal Diode Parameters
1
S
y
mbol Min T
yp
Max Unit Notes
I
forward bias
5500uA2
n_ideality 1.0000 1.0065 1.0173 3,4
Table 30. Thermal Diode Interface
Pin Name SC 242 Connector Si
g
nal # Pin Descri
p
tion
THERMDP B14 diode anode
THERMDN B15 diode cathode