Datasheet

Datasheet 3
Pentium
®
II Processor at 350 MHz, 400 MHz, and 450 MHz
Contents
1.0 Introduction.........................................................................................................................7
1.1 Terminology...........................................................................................................8
1.1.1 S.E.C. Cartridge Terminology ..................................................................8
1.2 References............................................................................................................9
2.0 Electrical Specifications....................................................................................................10
2.1 Processor System Bus and VREF ......................................................................10
2.2 Clock Control and Low Power States..................................................................11
2.2.1 Normal State—State 1 ...........................................................................12
2.2.2 AutoHALT Powerdown State—State 2...................................................12
2.2.3 Stop-Grant State—State 3 .....................................................................12
2.2.4 HALT/Grant Snoop State—State 4 ........................................................13
2.2.5 Sleep State—State 5..............................................................................13
2.2.6 Deep Sleep State—State 6 ....................................................................13
2.2.7 Clock Control..........................................................................................14
2.3 Power and Ground Pins ......................................................................................14
2.4 Decoupling Guidelines ........................................................................................14
2.4.1 Processor VCC
CORE
Decoupling............................................................15
2.4.2 Processor System Bus AGTL+ Decoupling............................................15
2.5 Processor System Bus Clock and Processor Clocking.......................................15
2.5.1 Mixing Processors of Different Frequencies...........................................15
2.6 Voltage Identification ...........................................................................................15
2.7 Processor System Bus Unused Pins...................................................................17
2.8 Processor System Bus Signal Groups ................................................................17
2.8.1 Asynchronous vs. Synchronous for System Bus Signals.......................19
2.8.2 System Bus Frequency Select Signal (100/66#)....................................19
2.9 Test Access Port (TAP) Connection....................................................................20
2.10 Maximum Ratings................................................................................................20
2.11 Processor DC Specifications...............................................................................21
2.12 AGTL+ System Bus Specifications .....................................................................24
2.13 System Bus AC Specifications............................................................................25
3.0 System Bus Signal Simulations........................................................................................36
3.1 System Bus Clock (BCLK) Signal Quality Specifications and Measurement
Guidelines ...........................................................................................................37
3.2 AGTL+ Signal Quality Specifications and Measurement Guidelines ..................38
3.3 Non-AGTL+ Signal Quality Specifications and Measurement Guidelines...........40
3.3.1 Overshoot/Undershoot Guidelines .........................................................41
3.3.2 Ringback Specification ...........................................................................41
3.3.3 Settling Limit Guideline...........................................................................42
4.0 Thermal Specifications and Design Considerations.........................................................42
4.1 Thermal Specifications........................................................................................43
4.1.1 Thermal Diode........................................................................................44
5.0 S.E.C.C. and S.E.C.C.2 Mechanical Specifications........................................................44
5.1 S.E.C.C. Mechnical Specifications......................................................................45