Technical Product Specification

Chassis Power Subsystem Intel® Server Chassis SC5600
Revision 1.1
Intel order number E39532-004
36
Figure 21: Power Supply Module Retention Mechanism
5.2.2 750-W Power Supply Module Output Wire Harness
The output wiring harness is part of the power distribution board (backplane) and is described in
that section.
5.2.3 750-W Power Supply Module Airflow Requirements and Temperature Rise
The power supply module incorporates fans for self-cooling and system cooling. The fans will
provide no less than 10 CFM airflow through the power supply when installed in the system.
5.2.3.1 Temperature Requirements
The power supply module shall operate within all specified limits over the T
op
temperature range.
All airflow shall pass through the power supply and not over the exterior surfaces of the power
supply.
Table 22: Thermal Requirements
Item Description MIN. MAX. Units
T
op
Operating temperature range 0 45
°C
T
non-o
p
Non-operating temperature range -40 70
°C
Altitude Maximum operating altitude N/A 1500 m
The power supply module meets Underwriters Laboratories (UL) enclosure requirements for
temperature rise limits. All sides of the power supply, with exception to the air exhaust side, are
classified as “Handle, knobs, grips, etc., held for short periods of time only.”
5.2.4 750-W Power Supply Module AC Specifications
The power supply incorporates universal power input with active power factor correction, which
reduces line harmonics in accordance with the EN61000-3-2 and JEIDA MITI standards. The
AC input connector shall be an IEC 320 C-14 power inlet. This inlet is rated for 15 A / 250 VAC.