Technical Product Specification

Intel® Server System SR2600UR TPS Cooling Subsystem
Revision 1.8 Intel order number E45274-011
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4.3.2 Full-height Riser Zone
The full-height riser zone is the area between the power supply assembly and the full-height
riser card of the riser assembly. The airflow through this area is generated by system fan 3 of
the fan module in a non-redundant fan configuration. In a redundant fan configuration, the
airflow for this zone is provided by system fans 5 and 6. Air is drawn from the drive bay area
through the fan and pushed out of the system through ventilation holes at the back of
the system.
4.3.3 CPU/Memory/Low-profile PCI Zone
The CPU/memory/low-profile PCI zone is the area between the low-profile riser card of the riser
assembly and the right chassis wall. In a non-redundant fan configuration, the airflow for this
zone is generated by system fans 1 and 2 of the fan module. In a redundant fan configuration,
the airflow for this zone is provided by system fans 1, 2, 3, and 4. Air is drawn from the drive
bay area, through the fans, directed through the CPU air duct, and out through ventilation holes
on both the back wall and rear side wall of the system. The CPU air duct combined with the
DIMM blanks is used to direct airflow through the processor heat sinks and memory areas for
both single and dual processor configurations.
Figure 20. CPU Air Duct with Air Baffle
4.4 Drive Bay Population
To maintain proper air pressure within the system, all hard drive bays must be populated with
either a hard drive or drive blank.
Figure 21. 3.5-inch Drive Blank