Technical Product Specification

3BCooling Subsystem Intel® Server System SR1625UR TPS
28 Intel order number E47487-012 Revision 2.0
Figure 17. Fan Header Assignments on Midplane
Table 21. Fan Header Assignment
Fan ID
Midplane Fan Header Name
Fan #1 – CPU2/System memory cooling FAN_1
Fan #2 – CPU2/System memory cooling FAN_2
Fan #3 – CPU1/System Memory cooling FAN_3
Fan #4 – CPU1/System Memory cooling FAN_4
Fan #5 - Full-height Riser Zone cooling FAN_5
4.2 Airflow Support
To control airflow within the system, a power supply air duct and CPU air duct are used to
isolate and direct airflow to three critical areas or zones: the power supply zone, the full-height
PCI zone, and the CPU/memory/low-profile PCI zone.
4.2.1 Power Supply Zone
A molded plastic air duct/baffle is used to isolate the airflow of the main system board zones
from the zone directly in front of the power supply modules. The power supply fans pull pre-
heated air from the leftmost drive bays across the Power Distribution Board to cool its
voltage regulators.