Technical Product Specification

Intel® Server System SR2625UR TPS Cooling Subsystem
Revision 1.8 Intel order number E46130-010
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through the fan and pushed out of the system through ventilation holes on the back side of
the system.
4.3.3 CPU/Memory/Low-profile PCI Zone
The CPU/memory/low-profile PCI zone is the area between the low-profile riser card of the riser
assembly and the right system wall. In a non-redundant fan configuration, the airflow for this
zone is generated by system fans 1 and 2 of the fan module. In a redundant fan configuration,
the airflow for this zone is provided by system fans 1, 2, 3 and 4. Air is drawn from the drive bay
area, through the fans, directed through the CPU air duct, and out through ventilation holes on
both the back wall and rear side wall of the system.
The CPU air duct is used to direct airflow through the processor heatsinks and memory areas
for both single and dual processor configurations.
Figure 21. CPU Air Duct with Air Baffle
4.4 Drive Bay Population
To maintain the proper air pressure within the system, all hard drive bays must be populated
with either a hard drive or drive blank.
Figure 22. 2.5-inch Drive Carrier with a Blank